Tutoriales

Encapsulados


Se describen aquí los nombres de los encapsulados existentes para circuitos integrados y otros componentes (los números entre paréntesis indican los modelos existentes, denotando el número de patillas):

BGA: ball grid array
BQFP: bumpered quad flat package
BQFPH: bumpered quad flat package with heat spreader

CBGA: ceramic ball grid array
CCC: ceramic chip carrier (sin plomo)
CerDIP: ceramic dual in-line package
CerPack: ceramic flatpack
CERQUAD: ceramic quad in-line package
CLCC: ceramic leadless chip carrier
CMPAK: compact mini package (Diodos Hitachi)
CMPAK: compact mini package (Transistores Hitachi)
CPGA: ceramic pin grid array
CSP: chip size package

DFP: dual flat package
DIL: dual in-line (8,14,16,18,20,22,24,28,32,40,48)
DIMM: dual in-line memory module
DIP: dual in-line package
DPAK: deca-watt package (Transistores Hitachi)
DSO: dual small outline package

EBGA: enhanced ball grid array
ERP: extremely small resin package (Diodos Hitachi)

FC: flip chip
FPAK: flat package (Diodos Hitachi)
FPBGA: fine pitch ball grid array
FPQFP: fine pitch quad flat package
FPT: fine pitch technology
FQFP: fine pitch quad flat package

HDPAK: huge deca-watt package (Transistores Hitachi)
HQSOP: hermetic QSOP (20,24)

LCBGA: low cost ball grid array
LCC: leadless chip carrier
LCCC: leadless ceramic chip carrier
LDPAK: large deca-watt package (Diodos Hitachi)
LLD: leadless diode (Diodos Hitachi)
LRP: large resin package (Diodos Hitachi)
LGA: land grid array

MELF: metal electrode face
MOP: mini oct-lead package (Transistores Hitachi)
MPAK: mini package (Transistores Hitachi)
MPAK: mini package (Transistores Hitachi)
MQFP: metric quad flat package
MQFP2: metric quad flat package with heat sink
MQFPH: metric quad flat package with heat spreader
MQUAD: metric quad (encapsulado plano)

PBGA: plastic ball grid array
PDIL: plastic dual in-line package
PDIP: plastic dual-in-line package
PGA: pin grid array package
PLCC: plastic leaded chip carrier (20,28,32,44,52,68,84)
PLCCH: plastic leaded chip carrier with heat spreader
PQ2: power quad flat package type 2
PQFP: plastic quad flat package
PSO: plastic small outline package

QFP: quad flat-pack (44S10,44S14,48S10,64REC,80REC,100REC,120,128,160)
QIL: quad in-line package
QIP: quad in-line package
QSOP: quarter size small outline package (16,20,24,28) o quality small-outline package
QTCP: quad tape carrier package
QUAD: quad in-line package
QUIL: quad in-line package
QUIP: quad in-line package

SD: side-brazed ceramic dual in-line package
SDIP: shrink dual in-line package
SGA: solder grid array
SHRDIL: shrink dual in-line (20,24,32,42,52,64)
SIL: single in-line (9,13,17)
SIMM: single in-line memory module
SIP: single in-line package
SMPAK: super mini package (Transistores Hitachi)
SO: small outline (8,14,16,20,24,28,32,28)
SOD: small outline diode
SOG: small outline IC* with gull-wing leads
SOIC: small outline integrated circuit (same as SO)
SOJ: small outline j-lead package
SONB: small outline narrow-body IC* with gull-wing leads
SOP: small outline package
SOT: small outline transistor
SP-10: single in line package 10 pin (Transistores Hitachi)
SP-12: single in line package 12 pin (Diodos Hitachi)
SPAK: small package (Transistores Hitachi)
SQFP: shrink quad flat-pack (32,48,64,80,208,240)
SQFP2: shrink quad flat package with heat sink
SQFPH: shrink quad flat package with heat spreader
SRP: small resin package (Diodos Hitachi)
SSO: single small-outline package
SSOP: shrink small outline package (20,24,28,48,56)
SSP: super small resin package (Diodos Hitachi)

TAB: tape automated bonding
TBGA: tape ball grid array package
TCP: tape carrier package
TD: top-brazed ceramic dual in-line package
TO: transistor single outline package
TQFP: thin quad flat package
TQFP2: thin quad flat package with heat sink
TQFPT: thin quad flat package with 1.0 mm body thickness
TSOP: thin small-outline package
TSOPII: thin small-outline package type II
TSQFP: thin shrink quad flat-pack (44,64,100)
TSSOP: thin shrink small outline package (20,24,28,48,56)

UMD: ultra mini diode (Transistores Hitachi)
UPAK: uni-watt package (Diodos Hitachi)
URP: ultra small resin package (Transistores Hitachi)

VQFP: very small quad flat package
VSO: very small outline (40,56)
VSOP: very small outline package
VTQFP: very thin quad flat package
VTSOP: very thin small outline package

ZIF: zero insertion force
ZIP: zig-zag in-line package